Prof. Dr.Q. J.M.Slaiman

    The main objective of this study is to electroplate different plastic types of thermoplastic as (ABS and polystyrene) and thermosetting as (epoxyfiberglass and phenolic) and to study the best graphite conductive colloid from particles size and binding agents to deposit graphite layer onto plastic surface. This process can make copper electroplating possible without intermediate conductive copper film deposited via electroless copper by using direct copper plating There are two reasons for using a copper layer. It makes the plastic component appear very bright because of its leveling and brightening properties. Furthermore, the copper layer is very soft and ductile and can compensate for the different thermal expansions between metal and plastic.The essential variables in present work from graphite particle size,binding agent on plastic types, concentration of copper sulfate, current density,plating time and temperature of acid copper solution  have two main effects:  a. Direct effect of the tests is the properties of the metal deposit on the plastics, as thickness, adhesion, surface roughness, porosity, and scratch resistance. b. Direct effect on the performance for cathodic current efficiency has been tested for four major factors that affect the plating process. These were concentration of CuSOacid copper plating.4.5H2O, temperature, current density, and time in The cathodic current efficiency for acid copper plating can be increased by increasing the concentration of copper, current density, and plating time. But it decreases by increasing the bath temperature. Relationships are found by using best fitting equations between these variables. The results of this study showed that the smaller graphite particle size under 36 µm and binding agents (epoxy resin) is more suitable for the process in order to achieve uniform thickness, good adhesion, smooth surface, reduced porosity, maximum load applying in scratch resistance to see how far it is durable in decoration and industrial purposes for these surfaces which lead to a best sample was (δ =38 µm) copper electrolplating thickness at peel strength ( σ=2kg / cm), roughness surface (R = 0.02 µm), porosity(φ =1.8%), scratch (2kg).The conditions of these tests are current density 3 A / dma , bath temperature 25oC, plating time 60 min., and solution of 200 g /L  CuSO O,50 g / L H 2SO4,


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